Thermal envelope (tdp, thermal design power). Low configurable thermal envelope frequency. Memory band width supported by the processor (max).
Id ark of the processor. Maximum internal memory supported by the processor. Types of memory supported by the processor. Memory clock speeds supported by the processor.
Maximum number of tracks pci express. Version of the pci express locations. Sse4.1, esse4.2, avx 2.0, avx-512. Export Control Classification Number (ECcn).
Automated commodity classification tracking system (ccats). Technology intel® hyper threading (intel® ht technology). Technology intel® identity protection (intel® ipt). New intel® aes (intel® aes-ni) instructions.
Technology trusted execution of intel®. Intel® turbo boost max technology 3.0 frequency. Intel® turbo boost technology 2.0 frequency.
Intel® Gaussan & Neural Accelerator (intel® gna) 2.0. Intel® increases temperature thermal speed. Intel® increases thermal speed frequency. Intel® vt-x with extended page tables (ept). Intel® program stable image platform program (sipp).
Intel® software guard extensions (intel® sgx). Intel® virtualization technology technology for directed e/s (vt-d). Technology 3.0 intel® turbo boost max.
Intel® deep learning boost (intel® dl boost). Size of the processor packaging. 37.5 x 37.5 mm.
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The seller is "yespon-shop" and is located in this country: it. This item can be shipped to the following country: france.